Name: Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (Ieee Press) (en Inglés)
Price: 554110.00 COP
Availability: InStock
Author: B Keser
ISBN: 9781119793779

portada Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (Ieee Press) (en Inglés)

Formato

Libro Físico

Editorial

John Wiley And Sons,

Autor

B Keser

Idioma

Inglés

N° páginas

320

Encuadernación

Tapa Dura

ISBN13

9781119793779

N° edición

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (Ieee Press) (en Inglés)

B Keser (Autor) · John Wiley And Sons, · Tapa Dura

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Reseña del libro "Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-In-Package (Ieee Press) (en Inglés)"

Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.