Name: Advanced Interconnect and Packaging (en Inglés)
SKU: 56772489
Price: 252775.00 COP
Availability: InStock
Author: Zhao, Wensheng
ISBN: 9783036567334

portada Advanced Interconnect and Packaging (en Inglés)

Advanced Interconnect and Packaging (en Inglés)

Formato

Libro Físico

Editorial

Mdpi AG

Autor

Zhao, Wensheng

Idioma

Inglés

N° páginas

266

Encuadernación

Tapa Dura

Dimensiones

24.4x17x2.2 cm

Peso

0.77 kg.

ISBN13

9783036567334

Categorías

Tecnología: cuestiones generales

Advanced Interconnect and Packaging (en Inglés)

Zhao, Wensheng (Autor) · Mdpi AG · Tapa Dura

Libro Nuevo Importado

Envío: 19 a 25 días háb.

$ 505.550$ 252.775

-50%

Costos de importación incluídos en el precio ✅

Libro Nuevo

Quedan 100 unidades

$ 252.775

¡Envío Gratis! Llega entre el 09 Oct y el 21 Oct a Bogota, Cundinamarca. Seleccionar ubicación

Agregar a lista de deseos

Reseña del libro "Advanced Interconnect and Packaging (en Inglés)"

Unlike transistors, the continuous downscaling of feature size in CMOS technology leads to a dramatic rise in interconnect resistivity and concomitant performance degradation. At nanoscale technology nodes, interconnect delay and reliability become the major bottlenecks faced by modern integrated circuits. To resolve these interconnect problems, various emerging technologies, including airgap, nanocarbon, optical, and through-silicon via (TSV), have been proposed and investigated. For example, by virtue of TSV technology, dies can be stacked to increase the integration density. More importantly, 3D integration and packaging also offer the most promising platform to implement "More-than-Moore" technologies, providing heterogeneous materials and technologies on a single chip. The "Advanced Interconnect and Packaging" Special Issue seeks to showcase research papers on new developments in advanced interconnect and packaging, i.e., on the design, modeling, fabrication, and reliability assessment of emerging interconnect and packaging technologies. Additionally, there are two interesting papers on carbon nanotube interconnects and interconnect reliability issues.