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Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés)
Hengyun Zhang; Faxing Che; Tingyu Lin; Wensheng Zhao (Autor)
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Woodhead Publishing
· Tapa Blanda
Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés) - Hengyun Zhang; Faxing Che; Tingyu Lin; Wensheng Zhao
$ 798.007
$ 1.330.012
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Origen: Reino Unido
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Reseña del libro "Modeling, Analysis, Design, and Tests for Electronics Packaging Beyond Moore (Woodhead Publishing Series in Electronic and Optical Materials) (en Inglés)"
Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included.