Name: The Mechanics of Solder Alloy Wetting and Spreading (en Inglés)
Price: 359312.00 COP
Availability: InStock
Author: Hosking, Michael ; Yost, Frederick G.
ISBN: 9781468414424

portada The Mechanics of Solder Alloy Wetting and Spreading (en Inglés)

The Mechanics of Solder Alloy Wetting and Spreading (en Inglés)

Formato

Libro Físico

Autor

Frederick G. Yost

Michael Hosking

Editorial

Springer

Idioma

Inglés

N° páginas

250

Encuadernación

Tapa Blanda

Dimensiones

22.9 x 15.2 x 2.0 cm

Peso

0.51 kg.

ISBN13

9781468414424

Categorías

Ingeniería eléctrica
Electrónica: circuitos y componentes
Jardinería

The Mechanics of Solder Alloy Wetting and Spreading (en Inglés)

Frederick G. Yost (Autor) · Michael Hosking (Autor) · Springer · Tapa Blanda

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Reseña del libro "The Mechanics of Solder Alloy Wetting and Spreading (en Inglés)"

In 1992 Congress passed the Defense Manufacturing Engineering Education Act with the intent of encouraging academic institutions to increase their emphasis on manufacturing curricula. The need for this incentive to integrate the academic and industrial communities was clear: gaps in manufacturing science were inhibiting the evolution of new manufacturing technologies that are required for the U.S. to maintain a competitive posture in the world marketplace. The Army Research Laboratory and Sandia National Laboratories sought to contribute to the congressional intent by initiating a new series of graduate level college textbooks. The goal was to focus next-generation scientists onto issues that were common to the needs of the commercial market, the affordability of DoD weapons systems, and the mobilization readiness of the U.S. Armed Forces. The textbook The Mechanics of Solder Wetting and Spreading was written in this spirit by nationally renowned scientists for academe and industry. Research- ers using the book are encouraged to formulate programs that will establish scien- tific correlations between manufacturing process controls and product reliability. Such correlations are essential to the building of a new electronics industry which is based upon the futuristic concepts of Virtual Factories, Prototyping, and Testing.