Name: Thermal design, simulation, and sensing of electronic products (en Inglés)
Price: 388825.00 COP
Availability: InStock
Author: Bin Qi;Fangyuan Li
ISBN: 9783659812224

portada Thermal design, simulation, and sensing of electronic products (en Inglés)

Thermal design, simulation, and sensing of electronic products (en Inglés)

Formato

Libro Físico

Editorial

KS OmniScriptum Publishing

Autor

Bin Qi;Fangyuan Li

Año

2024

Idioma

Inglés

N° páginas

312

Encuadernación

Tapa Blanda

Dimensiones

22.9 x 15.2 cm

ISBN13

9783659812224

Thermal design, simulation, and sensing of electronic products (en Inglés)

Bin Qi;Fangyuan Li (Autor) · KS OmniScriptum Publishing · Tapa Blanda

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Reseña del libro "Thermal design, simulation, and sensing of electronic products (en Inglés)"

Thermal design refers to the process of fully cooling electronic equipment through relevant technical means to meet the requirements of reliability and service life. Thermal design should be carried out at the same time as electrical design, structural design, and reliability design, and when there is a contradiction, a trade-off analysis should be carried out and a compromise should be solved. Engaged in thermal design work, you should master the basic knowledge of heat, fluid mechanics, etc., and put forward a reasonable thermal design scheme based on practical work experience. The heat dissipated by the device determines the temperature rise and, therefore, the temperature of any given structure; Heat is transferred by thermal conduction, convection, and radiation, and the heat transferred in each form is inversely proportional to its thermal resistance; Heat, thermal resistance, and temperature are important parameters in thermal design; All cooling systems should be the simplest and most economical, suitable for specific electrical and mechanical, and environmental conditions, while meeting reliability requirements.